TECHNOLOGY |
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| SMT Parts Spec | Outline Size | Min 0201(0.02inch*0.01inch) | |||||
| Max Size 45*45MM | |||||||
| Max Height of Components: 15MM | |||||||
| Min BGA,CSP (Pitch):≥ 0.3MM | |||||||
| Min SOP,QFP (Pitch):≥ 0.3MM | |||||||
| Min/Max Bare PCB Shape Spec For SMT | Length*Width | Min 50MM*50MM | |||||
| MAX 460MM*460MM | |||||||
| Board Thickness | Min 0.8 MM | ||||||
| Max 2.0 MM | |||||||
| Min/Max Bare PCB Shape Spec for DIP | Length*Width | Min 50MM*50MM | |||||
| MAX 350MM*350MM | |||||||
| Board Thickness | Min 0.8 MM | ||||||
| Max 2.0 MM | |||||||
